Message
OKI Printed Circuits provides "Total Board Solutions" for PCB interconnection of a variety of electronic components such as LSI, connector and so on, supporting our customers from design to manufacturing of value chain.
Today the demand for further miniaturization with higher performance of electronics instruments accelerates development of electronic devices such as LSI in terms of packaging density, function speed, and so on, which would require more wiring density/capacity or more precise control of trace impedance of a printed circuit board that interconnects those devices.
In design phase, OKI Printed Circuits will support our customers by doing simulation of electric characteristics of high speed circuit such as cross-talk or signal integrity, or by making proposal of wiring architecture based on thermal analysis of heat-generation by high density devices, utilizing our wide range of design/simulation capabilities.
In manufacturing phase, our PCB technology will support our customers by achieving wiring density/capacity, accuracy and high quality of PCBs that the customers' products will require in the future.
In addition, OKI Printed Circuits will continue to explore the possibility of device embedding technology, which is already available to enable further miniaturization and higher performance.
It is our commitment to contribute to the continuous development of electronics technology, by seeking the new possibilities of printed circuit interconnection, which, we believe, will lead to realization of affluent society.
Toshiyuki Tahara
President
OKI Printed Circuits Co., Ltd.
