Hiper Via Eliminating the wiring capacity bottleneck with UV-YAG laser micro-vias
With conventional micro-via forming techniques, it was necessary to use a resin material that did not contain glass cloth. It has been reported that the resulting difference in thermal expansion rates between the board and mounted components has caused stress-induced failures. At OKI Printed Circuits, we have developed a hyper-performance via system named Hiper Via, This system enables the use of conventional materials containing glass cloth using a micro-via forming technique that utilizes UV-YAG lasers. This makes it possible to ensure the same level of reliability as conventional engineering techniques.
The system also enables layer 1-3 and 1-4 connections, achieving a high wiring capacity. As an example, it is possible to draw wiring from a 0.5 mm pitch, 256-pin CSP full grid.
Sample construction (6 layers)
Sample 256-pin WL-CSP wiring
Increasing the package density eliminates the bottleneck of wiring capacity on printed circuit boards
As demands for high integration of electronic circuits increase, the density of IC packages is growing, as package sizes reduce and the number of pins increase. When mounting highly integrated IC packages like BGA and CSP on a printed circuit board, however, it has become unfeasible to ensure enough space for wiring using conventional through-hole formation techniques. At OKI Printed Circuits, we have solved this bottleneck in wiring capacity by developing Hiper Via: a micro-via formation technology that enables mounting of highly integrated IC packages.
Hiper Via design rule supporting 0.40 mm pitch BGA
Sectional view
| No. | Item | Specifications | Remarks |
|---|---|---|---|
| A | Thickness between layers L1 and L2 | 0.06 mm 0.1 mm | |
| B | L1-L2 via diam. | 0.05 mm MN | Laser via |
| C | L1-L2 surface land diam. | B+0.25 mm MN | Should be at least B+0.30 mm |
| D | L1-L2 intermediate land diam. | B+0.10 mm MN | Should be at least B+0.15 mm |
| E | Through-hole via diam. | 0.25 mm MN | Drill diameter |
| F | Through-hole via land diam. | E+0.25 mm | |
| G | Surface layer line width/space | 100/100 µm | |
| H | Inner layer line width/space | 50/50 µm | Drawn portion only; others 100/100 |
Hiper Via design rule supporting 0.50 mm pitch BGA
Sectional view
| No. | Item | Specifications | Remarks |
|---|---|---|---|
| A | Thickness between layers L1 and L2 | 0.06 mm 0.1 mm | |
| B | L1-L2 via diam. | 0.05 mm MN | Laser via |
| C | L1-L2 surface land diam. | B+0.25 mm MN | Should be at least B+0.30 mm |
| D | L1-L2 intermediate land diam. | B+0.10 mm MN | Should be at least B+0.15 mm |
| E | L2-L7 via diam. | 0.25 mm MN | Drill diameter |
| F | L2-L7 via land diam. | E+0.25 mm | |
| G | Through-hole via diam. | 0.25 mm MN | Drill diameter |
| H | Through-hole via land diam. | G+0.25 mm | |
| I | Surface layer line width/space | 100/100 µm | |
| J | Inner layer line width/space | 50/50 µm | Drawn portion only; others 100/100 |
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