Impedance Controlled Multilayer Printed Boards We are specialists in high-speed circuit multilayer boards
We began our business developing high-speed circuit boards for OKI's telecommunications carrier business. Building from that start, we have more than 15 years of experience developing and manufacturing impedance control boards. Leveraging the expertise and massive database that we have developed over this period, we propose printed boards with structures best suited to our customers' designs.
From design to board manufacture, OKI Printed Circuits board solutions are the most efficient solution both in terms of cost and lead-time from development to mass production.
Interstitial Via Hole (IVH) board
- OKI Printed Circuits Technologies
- Board type: BWB for press-fit, IC tester board, etc.
- Layers: up to 50
- Size: 670 x 570 mm; max. Thickness: 6.3 mm max.
- Characteristic impedance control: +/-5%
- Materials: FR-4, FR-5, BT, Polyimide, Low dk
- Product Specifications
- Layers: 20
- Structure: IVH, 10+10
- Board thickness: 3.2 mm (.126")
- Board size: 340 x 366.67 mm (13.39 x 14.44")
- Line width/space OL: 0.127/0.110 mm (.005/.0043") IL 0.1/0.114 mm (.004/.0045")
- Min. hole size (drill size) PTH: 0.35 mm (.0014"). IVH 0.25 mm (.001")
- Surface finish: HASL
- Material: High Tg FR-4
- Characteristic impedance: Single-end 50 ohm +/-10%, differential 90 ohm +/-10%
IVH board - sequential lamination
- OKI Printed Circuits Technologies
- Enables high layer count
- Enables many different IVH connections
- Enables Characteristic Impedance Control
- Product Specifications
- Number of layers: 4 to 28
- Board thickness: 0.5 (.020") to 4.2 (.165")
- Minimum IVH diameter: 0.2 mm (.008")
- Minimum land diameter: (OL) 0.5 mm (.020")
- Minimum land diameter: (IL) 0.5 mm (.020")
- Minimum line width: 0.075 mm (.003")
- Minimum line space: 0.125 mm (.005")
PAD on VIA board
- OKI Printed Circuits Technologies
- Capability of Resin-Filling
- Product Specifications
- Board size: 590 x 480 mm max.
- Board thickness: 0.6 to 6.3 mm
- Hole size: 0.35 mm/6.3 mm thick; 0.2 mm/3.5 mm thick
- Pad-on-via: OK
- Micro-via (bottomed) filling: 0.13 mm
Hiper Via board
- Product Specifications
- Layers: 16
- Laser micro vias: L1-2, L2-3
- Board thickness: 2.1 mm (.083")
- Board size: 235 x 415 mm (9.25 x 16.34")
- Line width/space: 0.10/0.10 mm (.004/.004")
- Min. hole size (drill size): 0.3 mm (.0012")
- Surface finish: Immersion silver
- Material: High Tg FR-4
- Characteristic impedance: 55 ohm +/-10%
Back-drill board
- Product Specifications
- Layers: 16
- Laser micro vias: L1-2, L2-3
- Board thickness: 2.1 mm (.083")
- Board size: 235 x 415 mm (9.25 x 16.34")
- Line width/space: 0.10/0.10 mm (.004/.004")
- Min. hole size (drill size): 0.3 mm (.0012")
- Surface finish: Immersion silver
- Material: High Tg FR-4
- Characteristic impedance: 55 ohm +/-10%
Back-drill board
- Product Specifications
- Layers: 26
- Laser micro vias: L1-2, L2-3
- Board thickness: 2.1 mm (.083")
- Board size: 235 x 415 mm (9.25 x 16.34")
- Line width/space: 0.10/0.10 mm (.004/.004")
- Min. hole size (drill size): 0.3 mm (.0012")
- Surface finish: Immersion silver
- Material: High Tg FR-4
- Characteristic impedance: 55 ohm +/-10%
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