Products and Services

Embedded Component Module Boards We offer creative technology and product solutions.

As electronic devices continue to grow smaller with increased functionality, we have seen an acceleration in the trend toward functinal modules in printed boards. Structures are becoming three-dimensional, as components are embedded in order to mount more functionality in a smaller volume.

At OKI Printed Circuits, we help our customers make their products smaller and with greater functionality by supporting the mass production of functional modules embedding wafer-level CSP (W-CSP) and passive components.

Benefits of Embedding Components

1. Greatly contributes to system miniaturization.
2. Can greatly reduce damping resistance and the like, by drawing wiring in concentrated constant channels to minimize the length of signal wiring. It can also reduce EMI radiation from signal wiring by minimizing feedback current loops.
3. It minimizes the wiring impedance component by optimally laying out bypass capacitors (shortest connections). This makes it possible to harness the capacitor's true frequency responsiveness, making it possible to supply the load required for element switching. It is consequently possible to reduce AC noise (power and ground bounce). Current feedback loops between the device's VCC terminal and ground terminal are also reduced, reducing EMI raditiation from the device. (See Fig. 1)

(Figure 1. Sample capacitor internals)

Features of OKI Boards with Embedded Components

1. We embed quality-assured W-CSPs.
   <No more problems with KGD (known good die)>
   Packages (wafer-level CSPs) are embedded after quality checking is completed, eliminating the impact of defective chips on completed module yields.
2. OKI can also work wafers made by other vendors into W-CSPs.
   We have the top share of the W-CSP foundary business. We can convert the wafers of many different vendors into W-CSP and embed them in our boards.
3. We embed general-purpose, commercially available components.
   <Ensures characterstics at least equivalent to conventional surface mounting>
   We can embed 0402, 0603, and 1005-size commercially available capacitors and resistors.
4. We use lead-free solder for component mounting connections.
   <Connection reliability at least equivalent to conventional surface mounting>
   We improve connection reliability by sealing component connectors in resin.
5. We offer an integrated supply readiness, from circuit design to mounting and testing.
   We use various types of simulation (thermal, SI/EMC, and high-speed/high-frequency) to propose the optimum structure.
   The OKI Group offers one-stop solutions.

Via Structure

Three-dimensional modules with embedded components require high-density, high-speed wiring housing technologies due to the constraints on wiring area and the faster signaling speeds. We achieve high density by integrating our Hiper-Via (UV-YAG laser vias with glass cloth enabling diameters of 50 microns) and B²it^TM (any-layer bump connection technology).

B²it is a registered trademark of Dai Nippon Printing Co., Ltd.
B²it: "Buried Bump Interconnection Technology"

Basic B²it process

Hiper Via is a registered trademark of OKI Printed Circuits Co., Ltd.

Benefits of Hiper Via Boards