Heavy Copper Multilayer Boards Providing heavy copper etching and layering technologies.
- Features
- While conventional products have a copper thickness of about 70 µm, this product has a copper thickness of 175 to 215 µm, improving heat-radiation characteristics.
- We utilize our multilayer manufacturing technologies and IVH manufacturing technologies to achieve heavy-copper blind-hole structures.
- Product Specifications
- 5-layer IVH structure (see figure below)
- Sample Solution
- Compact power source
- High-current board (10 A+)
- Related Solutions
