Ultrafast/High-Frequency Circuit Boards
We offer the optimum via structure for GHz-compatible printed boards.
Action
Reduces the difference beweeen the signal-wiring characteristic impedance and that of the vias.
Effect
- Uniform signal propagation speed
- Reduction of reflection/attenuation in transmission channel
Back-drilling method established
Use in thick printed circuit boards, such as back-planes supporting fast transmission.
Effect of via stub ablation method (back drilling)
Resolves TH mounting connector defects.
Impact on electrical characteristics of via stubs
The greater the difference in the characteristic impedance values of the vias and wiring, the greater the reflection and attenuation.
Wiring characteristics: wiring length = 100 mm; via count = 2
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